SDK v1.3.0 Release Notes

Since the release of version v1.2.0, we have made improvements and optimizations in several areas of the application. These changes are divided into two main sections: Major Changes and Changelogs. Here, we’ll provide a detailed explanation and enhanced descriptions.

Major Changes

In this update, we have made significant optimizations and upgrades to the core modules of the system to enhance performance, add new features, and improve user experience. The changes are primarily categorized into Major Features and Breaking Changes. Here are some of the key updates:

  • Major Features

    • Change default ftlv1 to default ftlv2.

    • Support app flash sec encryption.

    • Support app config file.

    • Support user data ota.

    • Add Blood Pressure Profile.

  • Breaking Changes

    • File and path Changed:

      • Include code path: bsp\driver\inc change to bsp\driver\adc\inc etc.

      • Source code path: bsp\driver\src change to bsp\driver\adc\src\rtl_common etc.

      • Register definition file path: bsp\driver\rtl87x2g change to bsp\driver\adc\src\rtl87x2g etc.

    • The directory structure has changed, and the project files need to be adjusted:

      • bsp\driver\inc change to bsp\driver.

      • bsp\driver\rtl87x2g\inc change to bsp\driver\nvic\inc, bsp\driver\pinmux\inc etc.

    • IP Naming Changed:

      • ADC_24BIT rename to HRADC.

      • 3WIRE_SPI rename to SPI3W.

      • RTZIP rename to IMDC.

      • WDG rename to WDT.

    • API Changed:

      • Added API: LCDC_ForceBurst, RCC_IRClkConfig, RCC_SPIClkConfig, pos_transfe, WDT_GetTimeoutMs, WDT_GetMode, AON_WDT_IsEnable, AON_WDT_GetTimeoutMs and AON_WDT_GetMode.

      • Modified API: PPE_blend_multi, DBIC_ReceiveBuf, get_format_data_len change to ppe_get_format_data_len

      • Init Struct Changed:

        • I2C: Add struct I2C_InitTypeDef member I2C_RisingTimeNsadded.

        • ADC: Add struct ADC_InitStruct member ADC_PowerOnDlyEn.

        • SEGCOMvoid SEGCOM_Pin_Init(SEGCOM_com_pin_cfg_Typedef com_cfg, SEGCOM_seg_pin_cfg_Typedef seg_cfg).

Change Logs

Meanwhile, in the changelog section, we have meticulously listed changes for each module, categorizing them into four main types: Added, Changed, Fixed, and Removed. You can review these changes in the following different modules:

Platform

  • Added

    • Support app flash sec encryption.

    • Support app config file.

    • Support heap_ext_data_sram_mask otp config.

    • Add power clock check cb.

    • Add psram low power driver.

    • Add get_ic_type() API.

    • Support LOG_TEXT print.

  • Changed

    • Change default ftlv1 to default ftlv2.

Peripheral Drivers

  • Changed

    • File and path Changed:

      • Include code path: bsp\driver\inc change to bsp\driver\adc\inc etc.

      • Source code path: bsp\driver\src change to bsp\driver\adc\src\rtl_common etc.

      • Register definition file path: bsp\driver\rtl87x2g change to bsp\driver\adc\src\rtl87x2g etc.

    • The directory structure has changed, and the project files need to be adjusted:

      • bsp\driver\inc change to bsp\driver.

      • bsp\driver\rtl87x2g\inc change to bsp\driver\nvic\inc, bsp\driver\pinmux\inc etc.

    • IP Naming Changed:

      • ADC_24BIT rename to HRADC.

      • 3WIRE_SPI rename to SPI3W.

      • RTZIP rename to IMDC.

      • WDG rename to WDT.

    • API Changed:

      • Added API: LCDC_ForceBurst, RCC_IRClkConfig, RCC_SPIClkConfig, pos_transfe, WDT_GetTimeoutMs, WDT_GetMode, AON_WDT_IsEnable, AON_WDT_GetTimeoutMs and AON_WDT_GetMode

      • Modified API: PPE_blend_multi, DBIC_ReceiveBuf, get_format_data_len change to ppe_get_format_data_len

      • Init Struct Changed:

        • I2C: Add struct I2C_InitTypeDef member I2C_RisingTimeNsadded.

        • ADC: Add struct ADC_InitStruct member ADC_PowerOnDlyEn.

        • SEGCOMvoid SEGCOM_Pin_Init(SEGCOM_com_pin_cfg_Typedef com_cfg, SEGCOM_seg_pin_cfg_Typedef seg_cfg).

Bluetooth

  • Added

    • Add Blood Pressure Profile.

    • Add gap_vendor_le_set_host_feature API.

  • Changed

    • Modify some bond related interfaces (provided in gap_storage_le.h): the original le_gen_bond_dev interface is changed to le_gen_bond_dev_v2, and the original le_set_dev_info and le_delete_dev_info interfaces are deleted.

  • Removed

    • Remove some gap_config interfaces (provided in gap_config.h), support setting some gap parameters through MPTool app config.

DFU

  • Added

    • Support user data ota.

    • Add rom watchdog and aon watchdog module.

  • Changed

    • Direct update secure images to inactive bank.

    • Use fmc flash api in ota.