Overview

In this document, it will be introduced how the powerful Realtek RTL87x3 series platform provides the capabilities to enrich developers’ applications. The Realtek platform offers high computation performance with ultra-low system power consumption. The rich IO interfaces can connect almost all external devices. The high-performance/good compatibility Bluetooth interface lets the application connect to the world through a wireless connection, allowing for endless possibilities.

More attractive application cases can be found on the Realtek official website: RealMCU.

The Benefit of the Realtek Solution

The Realtek platform provides the SoC platform with the following features:

  1. Rich and highly compatible peripheral interfaces for IoT and Bluetooth audio-enabled devices.

  2. High performance with low power consumption computation environment.

  3. Rich development documentation to bridge the gap between Realtek and developers.

  4. Mature mass production experience to assist developers in setting up the production line.

Document Mapping for Bluetooth Audio Solution

Here is the document mapping table for each part number.

Category Document Name Part Number Document
Quick Start RTL87x3 Quick Start
Tool Set RTL87x3 Tool Set
Platform Platform Overview RTL87x3 Platform Overview
Memory Hierarchy RTL87x3 Memory Hierarchy
Flash RTL87x3 Flash
Low Power Mode RTL87x3 Low Power Mode
Security Mechanism RTL87x3 Security Mechanism
Debug System RTL87x3 Debug System
Image Layout RTL87x3 Image Layout
Charger RTL87x3 Charger
Power Consumption RTL87x3 Power Consumption
Mbed TLS RTL87x3 Mbed TLS
Subsystems DFU RTL87x3 DFU
Audio Subsystem RTL87x3 Audio Subsystem
Audio Plugin RTL87x3 Audio Plugin
Audio Route RTL87x3 Audio Route
Audio Pipe RTL87x3 Audio Pipe
Notification RTL87x3 Notification
EQ RTL87x3 EQ
DSP Configuration RTL87x3 DSP Configuration
USB RTL87x3 USB
LE Manager RTL87x3 LE Manager
LE Audio Manager RTL87x3 LE Audio Manager
User Command Interface RTL87x3 User Command Interface
One Wire RTL87x3 One Wire
lwIP RTL87x3 lwIP
Protocols Bluetooth RTL87x3 Bluetooth
Samples Bluetooth RTL87x3 Bluetooth
OTA RTL87x3 OTA
IO RTL87x3 IO
USB RTL87x3 USB
GUI* RTL87x3 GUI
LCDC* RTL87x3 LCDC
Audio RTL87x3 Audio
Applications Bluetooth Audio Transceiver* RTL87x3 Bluetooth Audio Transceiver
Charging Case* RTL87x3 Charging Case
RWS RTL87x3 RWS
Development Tool MCUConfig Tool RTL87x3 MCUConfig Tool User Guide (PDF)
DSPConfig Tool RTL87x3 DSPConfig Tool User Guide (PDF)
Image Download Guide (For RD and Mass Production) RTL87x3 MPPG Tool User Guide (PDF)
Log Capture Tool RTL87x3 Debug Analyzer User Guide (PDF)
CLI Tool for Bluetooth Audio Transceiver* RTL87x3 ACI Host CLI Tool
RF Test and MP Tool RF Test and MP Tool User Manual RTL87x3 RF Test and MP Tool User Manual (PDF)
iOS/Android
Application
Development Kit
iOS OTA APP User Manual RTL87x3 iOS OTA SDK (ZIP)
iOS Audio Connect User Manual RTL87x3 iOS AudioConnect SDK (ZIP)
Android OTA APP User Manual RTL87x3 Android OTA SDK (ZIP)
Android Audio Connect APP User Guide RTL87x3 Android AudioConnect SDK (ZIP)
Datasheet RTL8763EAU RTL8763EAU MCU Datasheet (PDF)
RTL8763ESE RTL8763ESE MCU Datasheet (PDF)
RTL8763EFL RTL8763EFL MCU Datasheet (PDF)
RTL8763EW-VC RTL8763EW-VC MCU Datasheet (PDF)
RTL8763EWE-VP RTL8763EWE Series MCU Datasheet (PDF)
RTL8763EWE RTL8763EWE Series MCU Datasheet (PDF)
Hardware Instruction RTL87x3 Hardware Instruction (PDF)
HDK RTL8763EFL RTL8763EFL HDK (PDF)
RTL8763EAU RTL8763EAU HDK (PDF)
RTL8763ESE RTL8763ESE HDK (PDF)
RTL8763EW-VC RTL8763EW-VC HDK (PDF)
RTL8763EWE-VP RTL8763EWE-VP HDK (PDF)
RTL8763EWE RTL8763EWE HDK (PDF)
RTL8763EWM RTL8763EWM HDK (PDF)
RTL8773ESL RTL8773ESL HDK (PDF)
RTL8763EWS RTL8763EWS HDK (PDF)
Evaluation Board User Manual RTL87x3 Evaluation Board User Manual (PDF)

Note

  1. RTL87x3 series include RTL87x3E, RTL87x3D, and RTL87x3EP.

  2. The modules with asterisk superscripts (*) are only available in RTL87X3E-MCU-SDK-Common-v3.x.x.x.

  3. RWS application is only available in RTL87X3E-MCU-SDK-v3.x.x.x.

  4. The materials with the PDF and ZIP suffixes in the above image can be obtained from the Realtek official website at RealMCU.

  5. Other materials can be found in this online documentation.

SoC Hardware Platform Study Guide

Prior to designing the developer-specified device, developers can begin by reviewing the datasheet and the EVB platform to understand the characteristics of the SoC. They can then utilize the Realtek-recognized HDK to finalize the product. Developers can refer to the steps depicted in the following figure.

Note

  1. The materials with the PDF and ZIP suffixes in the above image can be obtained from the Realtek official website at RealMCU.

  2. Other materials can be found in this online documentation.

Datasheet

Provides detailed information on the specifications, features, and usage of the RTL87x3 series SoC.

Hardware Instruction

This document provides detailed information about the various hardware components that make up the EVB. It covers the mechanisms and functionalities of components such as the flash, microphone, and antenna. Additionally, the document includes various schematic diagrams to aid in understanding these details.

Evaluation Board User Manual

This document serves as an introduction to the hardware of the Evaluation Board. It provides essential information such as explaining the board’s interface, power supply mechanism, various IO ports, and pin allocation. Additionally, it includes information about the design aspects of the board itself.

SDK Software Study Guide

The Realtek SoC offers extensive development resources to assist developers in becoming familiar with the RTL87x3 series and to quickly initiate the actual development process. In the following sections, RTL8763ESE will be taken as an example to illustrate the document structure.

Developers can begin by exploring the SDK background and the required tools, and then utilize the sample applications to gradually acquaint themselves with the Realtek development environment. Here is the study guide for topics related to software development. Developers can refer to the steps depicted in the following figure.

Note

  1. The modules with asterisk superscripts (*) are only available in RTL87X3E-MCU-SDK-Common-v3.x.x.x.

  2. RWS application is only available in RTL87X3E-MCU-SDK-v3.x.x.x.

  3. The materials with the PDF and ZIP suffixes in the above image can be obtained from the Realtek official website at RealMCU.

  4. Other materials can be found in this online documentation.

Quick Start

Quick Start briefly covers important pins on the EVB, the process of generating and downloading images onto the EVB, printing logs, and provides information on other important documents. This document is particularly useful for those who are completely new to the topic and serves as a starting point for their understanding.

Tool Set

Besides the extension features developed in the SoC system, tool sets developed in the host are also provided in the sdk\tool directory for extended feature development, user application development, or mass production.

Tool Set provides a brief introduction to these tools and their release notes. For the user manual for each tool, please refer to the tool’s user manual in the specific directory.

Platform

In this chapter, we will start with an introduction to the SDK resources, assisting developers in effectively utilizing these resources for project development. Additionally, we will provide a detailed overview of essential platform components relevant to the development process, including Memory Management, Flash, Low Power Mode, Security Mechanisms, Debug System, Image Layout, Charger, and Power Consumption. Through these comprehensive descriptions, we aim to enable developers to fully understand and accurately use the SDK, thereby enhancing development efficiency and project quality.

  • Platform Overview: This document provides a guide for developing Bluetooth audio applications using the RTL87x3 SDK.

  • Memory Hierarchy: This document provides an overview of the memory system of the IC and provides instructions on its usage. The memory system includes ROM, RAM, external SPI Flash, and eFuse. The Cache has a separate RAM, which can also be configured as general RAM through Realtek Vendor registers. This flexible memory configuration mechanism enables the IC to cater to diverse applications with different memory usage needs.

  • Flash: Flash is a kind of non-volatile storage for code shadowing to RAM, executing code directly, or storing data. This document describes how to use Flash-related APIs and how Flash works in the IC.

  • Low Power Mode: The user guide aims to provide developers with a comprehensive understanding of the DLPS features and how to use them to maximize battery life. It describes how the DLPS works, how to enter and exit it, and important related APIs.

  • Security Mechanism: This paper introduces the security mechanism of the IC as well as its usage and guides developers on how to enable a non-secure IC as a secure IC, generate an RSA signature key, and prepare RSA signed images for the secure IC. If no security is enabled in products, please skip this document.

  • Debug System:

    • Debug Methods: This document introduces three debugging methods to debug user applications.

    • Debug Analyzer: The Debug Analyzer is an advanced diagnostic tool designed to simplify the debugging process for SDK users.

    • SWD: This introduction provides a general overview of SWD debug system.

  • Image Layout: Each image includes three parts: MP header, Image header, and Image payload. The purpose of this document is to provide a brief introduction to image layout.

  • Charger: The whole charger system can be split into two layers (upper layer and lower layer). The purpose of this document is to provide a brief introduction to the charger module.

  • Power Consumption:

    • Current Measure: This document introduces the current power consumption measurement scenario for RTL87x3 solution.

    • Optimizing Current Consumption: This document discusses how to optimize current consumption.

    • Platform Power Test: This article introduces how to measure the platform power consumption, including supported test scenarios, RCFG and EVB settings, and how to use CMD to measure power consumption.

  • Mbed TLS: Mbed TLS is an open-source cryptographic library designed to be lightweight and easy to use. It provides developers with a comprehensive range of cryptographic primitives, protocols, and algorithms necessary for developing secure applications.

Subsystems

A collection of the official Realtek libraries and sub-systems is provided in this module.

  • DFU: DFU represents the technology that uses Bluetooth to update the image (code and data) that runs on the Flash.

    • OTA: This document describes OTA related information.

    • CFU: This document describes CFU related information.

  • Audio Subsystem: This document provides information about the design philosophy and operating principle of the Audio Subsystem. The Audio Subsystem is an audio-specific domain architecture that standardizes the audio driver abstraction interfaces, virtualizes the audio stream routing mechanism, and provides various high-level modularized components.

  • Audio Plugin: This document provides information about the usage of the Audio Plugin module. The Audio Plugin is designed to meet the requirements of integrating external audio devices (vendor hardware Codecs, vendor DSPs, DACs, Amplifiers, etc.) into the Audio Subsystem. Developers can use the Audio Plugin module to implement collaborations between customized external audio devices and SoC internal devices.

  • Audio Route: The purpose of this document is to describe how to use the audio route module in the MCUConfig Tool. The MCUConfig Tool can demonstrate the audio route capability of each IC. Developers can configure the routing relationship of each audio stream using the MCUConfig Tool.

  • Audio Pipe: The purpose of this document is to introduce the concept and functionalities of Audio Pipe, its implementation features, as well as the operating principle between the Audio Pipe and the application layer.

  • Notification: This document mainly introduces the relevant content of Notification, including its architecture, operating principle with the application layer, and implementation.

  • EQ: This document aims to provide an overview of EQ, which is utilized to adjust the volume of various frequency bands in an audio signal.

  • DSP Configuration: The purpose of this document is to introduce DSP CFG module. MCU will load DSP related parameters from DSP CFG image, then send it to DSP.

  • USB: This document aims to provide an overview of the USB SDK. Several USB classes, including USB audio, HID, MSC, and CDC, are supported by the USB SDK. It might assist you in becoming familiar with the architecture of the USB driver.

  • LE Manager: This document aims to guide developers on how to use the Bluetooth LE Manager module. The chapter LE Manager Introduction gives an overview of the LE Manager.

  • LE Audio Manager: This document aims to guide developers on how to use the LE Audio Manager. The chapter LE Audio Manager Introduction describes how to initialize the LE audio library.

  • User Command Interface: The user commands are supported by LE Central application, LE Scatternet application, and LE Central Extended Scan application. The application needs to perform interactions by inputting commands through Data UART in PC. This document aims to guide users on how to use the user command interface.

  • One Wire: This document introduces the implementation and operational details of One Wire UART for communication between microprocessors using a single wire connection.

  • lwIP: lwIP is a small independent implementation of the TCP/IP protocol suite. This document describes how to test and implement TCP/IP with lwIP.

Protocols

The following user guides describe the supported protocols. They introduce concepts that are important to work with the protocol and guide through developing applications.

  • Supported Features: This document shows supported Bluetooth technology Features in RTL87x3E/RTL87x3D.

  • BR/EDR Host: This document gives an overview of Bluetooth BR/EDR Stack APIs.

  • LE Host: This document gives an overview of LE Stack Interfaces.

  • BR/EDR Profiles:

    • A2DP: This document describes the Advanced Audio Distribution Profile API definition.

    • AVRCP: This document describes the Audio Video Remote Control Profile API definition.

    • HFP: This document provides an overview of the HFP HF and HSP HS applications based on the HFP/HSP profile.

    • PBAP: This document describes the PBAP API definitions and how to use these APIs to pull phone book objects from the server device.

    • SPP: This document provides an overview of the Serial Port Profile.

    • iAP: This document provides an overview of the iAP application based on iAP profile.

    • HID: This document provides an overview of the HID Device application based on HID profile.

    • MAP: This document describes the MAP API definition and provides the capabilities of a client device for browsing, reading, and sending messages.

    • OPP: This document gives an overview of the Object Push Profile.

    • PAN: This document gives an overview of the Personal Area Networking Profile.

    • GATT over BR/EDR: The purpose of this document is to give an overview of the GATT over BR/EDR. When the application needs to transmit Attribute Protocol PDUs via BR/EDR transport, this functionality shall be added.

  • LE Audio Profiles:

    • HAP: This document introduces the use of HAP-related APIs to help users develop hearing aids products.

  • Bluetooth Qualification: This document introduces how to qualify and list your own products with minimal effort based on existing Realtek RTL87xx series and RTL88xx series qualified designs.

Samples

The Realtek SDK provides various samples, allowing developers to easily familiarize themselves with the SDK by studying the sample projects.

  • Bluetooth:

    • LE Broadcaster: It demonstrates how to use the LE GAP broadcaster role to develop many different broadcaster-role based applications.

    • LE Observer: It demonstrates how to use the LE GAP observer role to develop many different observer-role based applications.

    • LE Peripheral: It demonstrates how to use the LE GAP peripheral role to develop many different peripheral-role based applications.

    • LE Central: It demonstrates how to use the LE GAP central role to develop many different central-role based applications.

    • LE Scatternet: It demonstrates how to develop an application which supports the Peripheral Role and the Central Role at the same time.

    • LE Peripheral Extended ADV: It demonstrates how to develop different Peripheral Role based applications.

    • LE Central Extended Scan: It demonstrates how to develop many different Central Role based applications.

    • LE DTM: It provides an overview of DTM.

    • LE Audio CAP Initiator: It gives an overview of the LE audio CAP initiator sample.

    • LE Audio CAP Commander: It gives an overview of the LE audio CAP commander sample.

    • LE Audio CAP Acceptor: It gives an overview of the LE audio CAP acceptor sample.

    • BR/EDR Audio: It provides an overview of the BR/EDR audio demo application.

    • BR/EDR HID: It provides an overview of the BR/EDR HID demo application.

    • BR/EDR MAP: It gives an overview of the BR/EDR MAP demo application.

    • BR/EDR PBAP: It gives an overview of the PBAP demo application.

    • BR/EDR SPP: It gives an overview of the SPP demo application.

    • BR/EDR iAP: It gives an overview of the iAP demo application.

    • BR/EDR PAN: It provides an overview of the BR/EDR PAN demo application.

  • OTA: The purpose of this document is to give an overview of the OTA Demo application. The OTA Demo project gives a simple example of how to use OTA. This project implements dual bank OTA.

  • IO: This document describes the technical software details for the various peripherals supported by the IC. It includes information on the data structures used by the peripherals and the library functions that are supported.

  • USB:

  • GUI*: The purpose of this document is to give an overview of the GUI demo application. The GUI demo project provides a simple example of how to use GUI. This project implements a simple UI design with a touch pad as the input device.

  • LCDC*: The purpose of this document is to give an overview of the LCDC demo application. The LCDC demo project gives a simple example of how to use QSPI interface or I8080 interface to communicate with liquid crystal display controller.

  • Audio: The purpose of this document is to provide an overview of the audio demo application. The audio demo project serves as a simple example of how to utilize VP, Ringtone, APT, LLAPT, Audio Line, ANC, Audio Pipe and Audio Track.

Note

The modules with asterisk superscripts (*) are only available in RTL87X3E-MCU-SDK-Common-v3.x.x.x.

Applications

The Realtek SDK provides various applications to show developers how to start developing a customized user application.

Note

  1. The modules with asterisk superscripts (*) are only available in RTL87X3E-MCU-SDK-Common-v3.x.x.x.

  2. RWS application is only available in RTL87X3E-MCU-SDK-v3.x.x.x.

Tool

The SDK provides a variety of tools for extended feature development, user application development, or mass production. Each tool is accompanied by its respective user manual for reference.

Development Tool

Note

The tools with asterisk superscripts (*) are only available in RTL87X3E-MCU-SDK-Common-v3.x.x.x.

MCUConfig Tool User Guide

This article provides an explanation of the functions, usage, and settings of the MCUConfig Tool for Realtek Bluetooth Audio Chip. The Realtek Bluetooth MCU offers configurable Bluetooth settings and peripheral control. During the development stage, the MCUConfig Tool allows users to easily configure various MCU parameters.

The MCUConfig Tool organizes the setting elements into different tabs, including HW Feature, Audio Route, General, System Configuration, Charger, Ringtone, RF TX, and more. These configurations will be further described in the following sections.

DSPConfig Tool User Guide

This documentation provides detailed guidance on using the GUI to fine-tune the behavior of the DSP FW in the RTL87x3 IC series. The DSPConfig Tool allows developers to configure parameters of the built-in signal processing algorithms for voice and audio applications, as well as the hardware peripheral interfaces connected to the DSP core. These interfaces include the ADC, DAC, and I2S.

Additionally, the DSPConfig Tool offers user-friendly parameter fine-tuning functions, which can significantly reduce the time required for parameter tuning.

Furthermore, this tool supports the generation of DSP configuration files for the RTL87x3 toolchain, which includes flash download and mass-production software tools.

MPPG Tool User Guide

MPPG Tool supports flash programming for RTL87xx series chips. There are two modes available for downloading images to the chip. The MP Mode is used for factory mass production purposes, while the RD Mode is intended for factory R&D to perform debugging operations related to image downloading to the chip.

Debug Analyzer User Guide

Debug Analyzer is a tool utilized for capturing and decoding logs from the Realtek Bluetooth SoC chip. This document provides comprehensive instructions on how to configure and utilize the tool effectively.

ACI Host CLI Tool*

ACI Host CLI Tool is a test tool that runs on a PC and is designed to demonstrate the usage of ACI. It enables the execution of CMD/event communication tests with an ACI Device through a USB serial port.

RF Test and Certification Tool and MP Tool

RF Test and Certification Tool

This document provides instructions on how to establish the testing environment for the RTL87x3 RF. It covers various test modes specified in the Bluetooth specification, as well as the single-tone test mode. The guide is applicable to the entire RTL87x3 chip series. Additionally, this tool can assist in conducting certification tests for FCC, BQB, CE, SRRC, KCC, and others. In case any issues arise during the test, please reach out to the Realtek Bluetooth FAE for further assistance.

MP Tool

This document introduces and provides Realtek’s mass production solution for the RTL87x3 MP. It covers the MP flow and test items included in this MP solution. The guide is applicable to the entire RTL87x3 chip series. In case any issues arise during the test, please reach out to the Realtek Bluetooth FAE for further assistance.

Mobile Application Study Guide

Realtek also offers a guide if the product works with the mobile application. User manuals can be obtained from the Realtek official website at RealMCU.

iOS OTA APP User Manual

This user manual provides instructions for updating the APP through OTA using an iOS device.

iOS Audio Connect User Manual

Audio Connect is an application designed for controlling Realtek Bluetooth earphones/headsets. It offers several features including OTA updates, RHE function, Equalizer function, TTS, and various configuration options such as changing the name, language, and channel. The application is compatible with iOS 8.0 and later versions.

Android OTA APP User Manual

This user manual provides instructions for updating the application through OTA using an Android device.

Android Audio Connect User Guide

Audio Connect is specifically designed to cater to the production needs of Realtek RTL87xx SoC. It offers a range of features including TTS, OTA updates, Equalizer function, and allows for configuring various settings such as changing the device name. These features can be accessed after establishing a connection with an RTL87xx product.